Intel and SoftBank to Introduce New ZAM Memory for Artificial Intelligence
Intel, in partnership with SoftBank's subsidiary, Saimemory, is developing a new memory technology called Z-Angle Memory (ZAM). The project aims to address the shortage of high-performance memory caused by the boom in artificial intelligence.
ZAM uses an innovative layout approach—connections between chip layers are arranged diagonally ("Z-angle") rather than vertically, as in traditional memory. This allows for more efficient use of the chip's area, increasing data density and improving heat dissipation. The technology is likely to utilize copper hybrid bonding and a capacitor-less architecture, and Intel's EMIB technology will be used to connect to AI processors.
Compared to the current HBM standard, ZAM memory is expected to provide:
- A 40–50% reduction in power consumption.
- Simplification of the manufacturing process.
- An increase in capacity up to 512 GB per chip.
SoftBank's own Izanagi series chips may be the first to receive ZAM. The technology's success in the market will largely depend on its support from key players such as NVIDIA. For Intel, this marks a return to the DRAM memory segment, which the company exited in 1985.